Celcon® GC15
乙缩醛（POM）共聚物
Ticona

产品说明

Celcon® GC15 is an acetal copolymer grade utilizing a nominal 15 wt. % fiber glass level to increase stiffness and strength.

Chemical abbreviation according to ISO 1043-1: POM  
总体   
材料状态 • 已商用：当前有效  
供货地区 • 北美洲 • 拉丁美洲 • 南美洲
填料/增强材料 • 玻璃纤维增强材料, 15% 填料按重量 
性能特点 • 刚性，良好 • 共聚物 • 良好的强度
RoHS 合规性 • 联系制造商  
形式 • 颗粒料  
加工方法 • 注射成型  
树脂ID (ISO 1043) • POM  
   
物理性能  额定值单位制 测试方法
比重   
--  1.54g/cm³ ASTM D792
--  1.50g/cm³ ISO 1183
收缩率   
流动  0.40% ASTM D955
横向流动  1.8% ASTM D955
横向流量  0.90% ISO 294-4
流量  0.50% ISO 294-4
吸水率   ISO 62
饱和, 23°C  0.80% 
平衡, 23°C, 50% RH  0.20% 
机械性能  额定值单位制 测试方法
拉伸模量  5950MPa ISO 527-2/1A/1
抗张强度   
屈服, 23°C  85.5MPa ASTM D638
断裂  91.0MPa ISO 527-2/1A/5
拉伸应变 (断裂)  2.5% ISO 527-2/1A/5
弯曲模量   
23°C  4960MPa ASTM D790
23°C  5850MPa ISO 178
冲击性能  额定值单位制 测试方法
简支梁缺口冲击强度 (23°C)  4.9kJ/m² ISO 179/1eA
悬壁梁缺口冲击强度   
23°C  64J/m ASTM D256
23°C  5.3kJ/m² ISO 180/1A
热性能  额定值单位制 测试方法
热变形温度   
1.8 MPa, 未退火  130°C ASTM D648
1.8 MPa, 未退火  159°C ISO 75-2/A
维卡软化温度  161°C ISO 306/B50
熔融温度   
-- 2  166°C ISO 11357-3
--  165°C ASTM D3418
线形膨胀系数   ISO 11359-2
流动  0.000046cm/cm/°C
横向  0.00010cm/cm/°C
   
注射  额定值单位制 
加工（熔体）温度  182 到 199°C 
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Celcon® GC15 2012年10月14日
乙缩醛（POM）共聚物 
Ticona 
注射 额定值单位制
模具温度 93.0 到 121°C

注射说明

Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (i.e.- general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the Celcon material.

Melt temperature: preferred range 182-199 C (360-390 F) Melt temperature should never exceed 230 C (450 F).Mold surface temperature: preferred range 93-121 C (200-250 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3 mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6 mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may produce a hazy surface or a surface with flow lines, pits and other included defects.

备注
1 一般属性：这些不能被视为规格。

2 10°C/min

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